Analysis Partnerships

ROIE recognizes that the requirement for manufacturers and designers to be using advanced analysis is growing all of the time;
as is the cost of entry into these areas. When the costs of additional
hardware, software, training and ramp up time are lumped together, the overall cost of moving into a new analysis area is very significant.

One way to hedge this level of investment is to enter into an
Analysis Partner relationship with ROIE. The essence of this
relationship is that for a specified period and a specified rate, ROIE
will provide engineering and analysis services on demand. The benefit to you is a flat, pre-negotiated rate, a hedge to the high cost of entry, no ramp up and training delays, and immediate access to
experienced individuals. The benefits of doing this are being enjoyed
by several of our customers looking for advanced, specialized
capability at a reasonable cost. In support of this we are expanding
our expertise to include advanced CFD using ANSYS/CFX, advanced meshing with ANSYS/ICEM-CFD and advanced explicit analysis using ANSYS/LSDyna.

Fully meshed Printed Circuit Board (PCB) ready for a thermal management transient thermal analysis using ANSYS IceBoard.